Model: TePla 300
Manufacturer: PVA
Area: Chemical area

The TePla 300 Plasma asher can be used to strip off photo resist, descum or for cleaning of a wafer surface. 

Available process gases: O2, Ar, N2

Maximum power: 1000W

Contact:

Martijn de Roosz

Senior Engineer

NTNU NanoLab

Responsible for Thin Film deposition and Dry Etch section at NTNU NanoLab.

+47 46932581
martijn.de.roosz@ntnu.no