Model: EVG 101S
Manufacturer: EVG Group
Area: Clean room

Wafer size: 150 mm

Different positive and negative positive resists can be spray coated. Wafers are loaded manually. The tool has edge-handling chucks as well as full-contact chucks with heating.

Spray coating technology provides several benefits and allows the ability to overcome remaining drawbacks of spin coating and can provide uniform coatings on non-planar surfaces or even inside cavities. Using a pressure-less ultrasonic atomization of the resist material guarantees precisely controlled droplet size and its narrow spectral distribution independent from N2 flow. Fully recipe-controlled spray nozzle parameters and x/y meander movement provide high flexibility and repeatability of the spray coating process. The heated chuck system can further extend the application range.