MASTER Mini PSG-532
The machine is equipped with a solid-state pulsed nanosecond laser operating a fixed wavelength of 532 nm that is suitable for both scribing and cutting. The sample stage provides a maximum scribing area of 16 x 16 cm2, which is large enough to accommodate commercial 6-inch wafers. User-friendly standard recipes are available for different materials, both as single-line cuts and as 10 x 10 mm patterns. An optical camera system enables automatic sample alignment as well as z-stage aligment. Please note that the standard recipes for the different materials are tailored to ensure a high quality cut, and are the only recipes that should be used. In the case where you need to cut a different material or with a custom pattern, please contact the tool-responsible.
Laser: Air-cooled, solid-state nanosecond pulsed laser (Class 3).
Laser focus: Automated Z-axis adjustment with precision of 1 micrometer.
Laser alignment: A secondary HeNe laser is also available visualize the desired pattern on the sample prior to cutting.
Sample size: Large sample stage (16 x 16 cm2) permits scribing of large wafers in a single run.
In general, samples should be no more than 2 mm thick. Standard cutting processes have been developed for a variety of materials including:
Due to potential damage to the machine, scribing or cutting of materials with higly reflective surfaces is not permitted. For untested materials, please contact the tool-responsible to discuss your needs. N2