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Technologies
Bonding and packaging
Characterisation
Chemical methods
Dry etch
Lithography
Sample preparation
Thermal processes
Thin film deposition
Labs
NTNU NanoLab
UiO MiNaLab
USN MST-Lab
SINTEF MiNaLab
Highlights
Access & Pricing
About
About Norfab
Contact us
Employees
LIMS
NTNU
USN
UiO
SINTEF MiNaLab
MENU
Home
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Technologies
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Bonding and packaging
Die Bonder, TPT
Model:
HB70
Manufacturer:
TPT
Area:
G2-33 Cleanroom
NTNU NanoLab
UiO MiNaLab
USN MST-Lab
SINTEF MiNaLab
