Tool description
A stand-alone, single wafer etcher with one reactor and cassette to cassette automatic wafer handling. The Rapier process module is equipped with a patented design of dual high- density inductively coupled plasma (ICP) sources with independently controlled primary and secondary decoupled plasma zones, with independent dual gas inlets. This enables excellent uniformity of etch profiles and control of structure tilt across the wafer. The Rapier is purpose built for deep reactive ion etching (DRIE) and high aspect ratio etching of silicon using the Bosch (switched) process. In addition, it is also possible to perform (continuous) RIE etch processes such as etching of thin films of SiO2, Si3N4, polySi and organic materials.
Technical information
Contact persons
Process responsible: Anand Summanwar
Senior Process Scientist
Dept. of Smart Sensors & Microsystems
SINTEF Digital
Email: Anand.Summanwar@sintef.no
Tel: +47 9823 0490
Service responsible: Tri Huu Nguyen
Senior Engineer
Dept. of Smart Sensors & Microsystems
SINTEF Digital
Email: TriHuu.Nguyen@sintef.no
Tel: +47 9162 2832