Vertical range: 25 Å to 262 μm.
Vertical resolution: 1 Å max (at 6.55 μm range).
Scan length range: 50 μm to 50 mm.
Scan duration range: 3 s to 100 s.
Maximum sample thickness: 25.4 mm.
Maximum wafer size: 200 mm (diameter).
Maximum sample weight: 2.5 kg.
Stylus force: programmable, 1 mg – 15 mg.
Stylus options: Diamond-tipped, 12.5 μm radius (standard) and 5 μm radius (for scratch-free characterization of delicate sample, e.g., Au or oxide films).
Software: Vision ® 32 3D analysis package; D8-STRESS software.
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