Electroplating System

Electroplating is a process of depositing a layer of any desired metal onto a another material. A power supply supplies a current between an anode and a cathode (your sample). The dissolved metal ions in the electrolyte solution are reduced at the cathode and therefore plate out on your wafer.

The system is designed to do precise plating of 2-4 inch silicon wafers using dedicated jigs.

The system is right now set up for Pt black. It will be set up for Au and Ni in the near future.

Contact:

Mathilde Barriet

Senior Engineer

NTNU NanoLab

Responsible for organic chemistry, air sensitive synthesis, PDMS/Silanisation and lithography chemicals.

+47 91897208

mathilde.i.barriet@ntnu.no