Electroplating of Cu and Sn

Electroplating is a plating/deposition process in which metal ions in a solution are moved by an electric field to coat an electrode. The process uses electrical current toreduce cations of a desired material from a solution and coat a conductiveobject with a thin or thick layer of the material, such as a metal. Possible metals to plate are Au, Cu, Sn and Pt by either using DC, pulse (PC) or pulse reverse current (PRC). The advantages of PC and PRC compared to DC is that a more uniform film is obtained at a faster deposition rate, because the negatively charged layer around the cathode preventing the ions to reach the sample (cathode) is somewhat discharged and redistributed during pulse off time.Possible processes:

• DC, PC and PRC Electroplating
• Au, Cu, Sn and Pt Metals

  Technical data: Handles 100mm wafers and pieces.

Contact:

Zekija Ramic

Chemist

USN MST-Lab

Chemical and biological methods
Dry etch
Lithography
Thermal processes
Thin film deposition

+47 41228133

zekija.ramic@usn.no