E-Beam Evaporator – Pfeiffer

An e-beam evaporator is used to deposit single or multilayer thinfilms of metals, oxides, magnetic materials and dielectrics. An electron beam is sweeped over the target surface transforming target atoms into gaseous phase which precipitates into solid form coating the chamber. This takes place under high vacuum (~10-7 Torr) enabling the atoms to evaporate freely in the chamber. The deposition thickness is controlled by a quartz crystal monitor.Minimum controlled deposition is ~1 nm and maximum is a few hundred nm (depending on material). The deposition rate can be varied from ~0,1 nm/s to ~ 0,5 nm/s. Deposition thickness has a uniformity of >95% accross a 4 inch wafer. Sample rotation is used to increase the uniformity.

Materials allowed: 

Everything which is not considered as contaminating within NanoLab rules, sample size can’t exceed 101.6 mm (4”) in diameter and 10 mm in thickness.

Technical Information:

• Model:Pfeiffer Vacuum Classic 500.
• Available targets:, Ti, Au, Cr, Pt, Ni, NiFe, Co, Al, SiO2, Al2O3, Si, C, Cu, Fe, Ag, Ru, ITO, TiO2 and Ta. 
• Deposition rate: 1 – 5 Å/s
• Layer thickness: from a few nm up to a few hundred nm (depending on target material)
• 8 kV acceleration voltage.
• 8 evaporation pockets.
• Base vacuum: 1E-7 mbar
• Water cooling on substrate