Model: Vacuum Classic 500
Manufacturer: Pfeiffer
Area: Thin Film & Dry Etch

An e-beam evaporator is used to deposit single or multilayer thin films of metals, oxides, magnetic materials and dielectrics. An electron beam is swept over the target surface transforming target atoms into gaseous phase which precipitates into solid form coating the chamber. This takes place under high vacuum (~10-7 Torr) enabling the atoms to evaporate freely in the chamber. The deposition thickness is controlled by a quartz crystal monitor. Minimum controlled deposition is ~1 nm and maximum is ca. 200 nm (depending on material). The deposition rate can be varied from ~0,1 nm/s to ~ 0,5 nm/s. Deposition thickness has a uniformity of >95% accross a 4 inch wafer. Sample rotation is used to increase the uniformity.

Materials allowed: 

Everything which is not considered as contaminating within NanoLab rules, sample size can’t exceed 101.6 mm (4”) in diameter and 10 mm in thickness.

Technical Information:

  • Model:Pfeiffer Vacuum Classic 500.
  • Available targets:, Ti, Au, Cr, Pt, Ni, NiFe, Co, Al, SiO2, Al2O3, Cr2O3, Si, C, Cu, Fe, Ag, Ru, ITO, TiO2 and Ta. 
  • Targets Installed: Ti/Ag/TiO2/Pt/Cr/Au/SiO2/Al (26.05.2026).
  • Deposition rate: 1 – 5 Å/s (depending on target material).
  • Layer thickness: from a few nm up to ca. 200 nm (depending on target material).
  • 8 kV acceleration voltage.
  • 8 evaporation pockets.
  • Base vacuum: 1E-7 mbar.

Training duration: 2 hours.