Model: Rapier
Manufacturer: SPTS
Area: Thin Film & Dry Etch

The Deep Silicon Etcher (DRIE) is a tool to etch silicon. It makes use of the Bosch-process where etch steps and side wall passivation steps alternate. C4F8 gas is used to create a passivation layer (side wall protection) and SF6 is used to etch. It is a technique that is very suitable to create deep anisotropic features with a high aspect ratio.

More information will follow soon and the first user trainings are planned to start in August 2024.


Martijn de Roosz

Senior Engineer

NTNU NanoLab

Responsible for Thin Film deposition and Dry Etch section at NTNU NanoLab.

+47 46932581