Model: Rapier
Manufacturer: SPTS
Area: Thin Film & Dry Etch

The Deep Silicon Etcher (DRIE) is a tool to etch silicon. It makes use of the Bosch-process where etch steps and side wall passivation steps alternate. C4F8 gas is used to create a passivation layer (side wall protection) and SF6 is used to etch. It is a technique that is very suitable to create deep anisotropic features with a high aspect ratio.

More information will follow soon and the first user trainings are planned to start in August 2024.

Contact:

Martijn de Roosz

Senior Engineer

NTNU NanoLab

Responsible for Thin Film deposition and Dry Etch section at NTNU NanoLab.

+47 46932581
martijn.de.roosz@ntnu.no