E-beam and thermal PVD – Angstrom

Instrument model:

Technology Description:

E-beam PVD and thermal evaporation are efficient and user-friendly techniques for depositing high-quality metal contacts, metal- and metal oxide thin films. A crucible containing pellets of the desired material is heated using either an electron beam or resistive heaters to melt the material and cause evaporation. The substrate, mounted in the top of the chamber, will thus be coated with the evaporated material. For applications that require high-quality interfaces and thin films, e-beam PVD is the recommended technique. 

Technical Information:

Sources: 1 E-beam (Telemark) and 2 resistive heaters.

Low vacuum: below 1×10^-7 Torr base pressure.

Substrate size: 6” Single wafer chamber, but smaller samples can be mounted on the sample holder.

Substrate heating: 20 ºC – 500 ºC

Multilayered deposition: Up to 6 different layers can be deposited without breaking vacuum.

Thin film thickness: down to 10 nm thickness is possible. Upper limit is limited by the amount of material that is in the 7cc crucible.

Gas: O₂ for reactive evaporation.

Co-deposition: Up to three materials can be deposited in parallel, employing all three sources.

Materials: Al, Ti, Ni, NiO, Pt, Pd, SiO₂. Other materials may be available upon request. For deposition of Au, please see the Tornado E-beam or Baltzers thermal evaporator.